JPH0225252Y2 - - Google Patents

Info

Publication number
JPH0225252Y2
JPH0225252Y2 JP1984114057U JP11405784U JPH0225252Y2 JP H0225252 Y2 JPH0225252 Y2 JP H0225252Y2 JP 1984114057 U JP1984114057 U JP 1984114057U JP 11405784 U JP11405784 U JP 11405784U JP H0225252 Y2 JPH0225252 Y2 JP H0225252Y2
Authority
JP
Japan
Prior art keywords
terminal piece
circuit board
printed circuit
solder
bonding chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1984114057U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6130274U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11405784U priority Critical patent/JPS6130274U/ja
Publication of JPS6130274U publication Critical patent/JPS6130274U/ja
Application granted granted Critical
Publication of JPH0225252Y2 publication Critical patent/JPH0225252Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Electrical Connectors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP11405784U 1984-07-26 1984-07-26 部品取外装置 Granted JPS6130274U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11405784U JPS6130274U (ja) 1984-07-26 1984-07-26 部品取外装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11405784U JPS6130274U (ja) 1984-07-26 1984-07-26 部品取外装置

Publications (2)

Publication Number Publication Date
JPS6130274U JPS6130274U (ja) 1986-02-24
JPH0225252Y2 true JPH0225252Y2 (en]) 1990-07-11

Family

ID=30673085

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11405784U Granted JPS6130274U (ja) 1984-07-26 1984-07-26 部品取外装置

Country Status (1)

Country Link
JP (1) JPS6130274U (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4598620B2 (ja) * 2005-07-22 2010-12-15 富士通株式会社 対象部品の取り外し方法及び取り外し治具

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4851845A (en]) * 1971-10-28 1973-07-20
JPS5873188A (ja) * 1981-10-27 1983-05-02 富士通株式会社 プリント板からの電子部品自動取外し装置

Also Published As

Publication number Publication date
JPS6130274U (ja) 1986-02-24

Similar Documents

Publication Publication Date Title
US4934582A (en) Method and apparatus for removing solder mounted electronic components
JPH0225252Y2 (en])
US3632036A (en) Electrical component desoldering and extracting tool
US4819327A (en) Soldering method for printed circuit board
CN221927648U (zh) 电阻器固定座
JPS60201696A (ja) フラツトパツケ−ジの半田付方法
JPH0222141Y2 (en])
JPS58169993A (ja) 部品実装方法
JPS6328095A (ja) 形状記憶合金を用いた半導体パツケ−ジの実装装置
JPH02254787A (ja) 表面実装用基板への電子部品の実装方法
JPH0337466B2 (en])
JPS5919424Y2 (ja) 磁器コンデンサを有するパッケ−ジ
JPH075636Y2 (ja) 電子部品のリムーブ治具
JPS5814625Y2 (ja) 半田ディップ時のスル−ホ−ルマスク
JPS632305Y2 (en])
KR890004714Y1 (ko) 불량 ic 취출장치
JPS6291000A (ja) プリント基板の製造方法
KR900002182Y1 (ko) 양면 부착식 프린트 회로 기판
JPS61263191A (ja) 電子部品の実装方法
JPS59207690A (ja) 集積回路素子の実装方法
JPH0125490Y2 (en])
JPS62241281A (ja) ピンジヤツク取付方法
JPS5815295A (ja) 半田付部品取外し方法
JPH01133393A (ja) 電子部品の実装法
JPH0385799A (ja) シールドケース